Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate
Küçük Resim Yok
Tarih
2017
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Polish Acad Sciences Inst Physics
Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
In the present study, wetting behaviors of Sn-9Zn-x Al ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-x Al alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9 degrees C. It was determined that wetting capability of Sn-9Zn-x Al alloys failed because of oxidation.
Açıklama
6th Congress and Exhibition on International Advances in Applied Physics and Materials Science (APMAS) -- JUN 01-03, 2016 -- Istanbul, TURKEY
Anahtar Kelimeler
Sn-Zn, Cu, Microhardness, Behavior, Al
Kaynak
Acta Physica Polonica A
WoS Q Değeri
Q3
Scopus Q Değeri
Q4
Cilt
131
Sayı
1
