Erer, A.M.Uyanik, O.Türen, Y.2024-09-292024-09-2920192148-3736https://doi.org/10.31202/ecjse.441434https://search.trdizin.gov.tr/tr/yayin/detay/386025https://hdl.handle.net/20.500.14619/9017This study reports the investigation on indium addition into Sn–3Ag-0.5Cu (SAC305) ternary Pb-free solder alloy to evole its varied performances. The effects of indium addition on wettability of the solder alloy was studied. The experimental results exhibited that when the addition of indium was 1.0 wt.%, the change in melting temperature of Sn–2Ag-0.5Cu–1In (SAC-1In) solder was negligible, but the contact angles (?) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in Ar atmosphere. Inter-metallic phases, microstructures, and melting temperatures of alloy was characterized by X-ray diffraction (XRD), scanning electron microscope and energy dispersive X-ray spectroscopy (SEM + EDX), and differential scanning calorimeter (DSC), and effects of the amount of In on microstructure were investigated. The lowest ? was obtained as 35,55° at 310 °C. The formation of intermetallic compounds (IMC’s) between the Pb-free solder alloy and the Cu substrate was observed. As a result, the studies show that the wetting capability of Sn–2Ag-0.5Cu–1In quaternary solder alloy is better than Sn–3Ag-0.5Cu ternary alloy. © 2019, TUBITAK. All rights reserved.eninfo:eu-repo/semantics/openAccessContact AnglePb-free Solder AlloysWettabilityArticle10.31202/ecjse.4414342-s2.0-8515074731071Q413860256