Oguz, SerkanErer, Ahmet Mustafa2024-09-292024-09-2920230031-89491402-4896https://doi.org/10.1088/1402-4896/acfb44https://hdl.handle.net/20.500.14619/5861In this study, the wetting and microstructural properties of SACBi-xAl (x = 0.05, 0.1, 0.3, 0.5, and 0.6%) quinary lead-free solder alloys produced by adding various amounts of Al to the quaternary SAC-1Bi lead-free solder alloy (wt%) were investigated. The wetting and microstructural properties of Al-added quinary lead-free solder alloys on Cu substrate in an Ar gas atmosphere were investigated. It was reported that the best wetting angle (38.44 degrees for the 325 degrees C temperature value) and melting temperature (212.5 degrees C) belonged to the SACBi-0.1Al solder alloy. When the microstructural properties are examined, it is seen with the help of SEM images that the CuAl IMC phase, which is rich in Al, has replaced Cu6Sn5 and Ag3Sn IMCs.eninfo:eu-repo/semantics/closedAccessAl-added lead-free solder alloywetting angleSACBi-Alsessile dropArticle10.1088/1402-4896/acfb442-s2.0-8518202975911Q298WOS:001081812300001Q2