Öz, Ö.Özer, H.2024-09-292024-09-292019978-111962532-2978-111962525-4https://doi.org/10.1002/9781119625322.ch3https://hdl.handle.net/20.500.14619/9692Adhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints. © 2019 Scrivener Publishing LLC.eninfo:eu-repo/semantics/closedAccessAnalytical and numerical studiesBi-adhesiveModulus-graded adhesiveBook Part10.1002/9781119625322.ch32-s2.0-8510216126597N/A77