Kurt, SerefUysal, BurhanettinOzcan, Cemal2024-09-292024-09-2920080021-8995https://doi.org/10.1002/app.28693https://hdl.handle.net/20.500.14619/3634In this study, it is aimed to describe the effect of adhesives (PVAc-polyurethane and urea formaldehyde) on wooden materials (Scotch pine and oriental beech) cut tangentially and radially and layers in laminated veneer lumber (LVL; 3, 4, 5) on thermal conductivity. The lowest thermal conductivity of 0.105 kcal/(m h degrees C) was obtained in Scotch pine, cut tangentially, bonded with polyurethane, and three-layer LVL. The highest thermal conductivity of 0.159 kcal/m h degrees C was obtained in oriental beech, cut radially, bonded with PVAc, and five-layer LVL. Consequently, oriental beech wood cut radially and bonded with PVAc adhesive and five layers in LVL can be used as a material in construction where the thermal conductivity is required. Scotch pine wood cut tangentially and bonded with polyurethane adhesive and three layers in LVL can be used as a material in construction where the insulation is required. (C) 2008 Wiley Periodicals, Inc.eninfo:eu-repo/semantics/closedAccesslaminated veneer lumberadhesivethermal conductivitygrain orientationArticle10.1002/app.286932-s2.0-5384909138918273Q21822110WOS:000259168100068Q2