Özbay, G.Kokten, E.S.Ozcifci, A.2024-09-292024-09-2920211336-4561https://doi.org/10.37763/WR.1336-4561/66.1.161169https://hdl.handle.net/20.500.14619/8950In this work, resol type phenol-formaldehyde (RPF) resin was modified with silicon dioxide nanoparticles (SiO2-Np). SiO2-Np was added at varying ratios from 1 to 4 wt.% to improve the bonding performance of the RPF resins. The physical characteristics of the nano-modified RPF (nano-RPF) resins were examined. The effects of modification were studied by Fourier transform infrared spectroscopy (FT-IR) and thermogravimetric analysis (TGA). The results of FT-IR revealed that the nano-RPF resins were successfully produced by phenol, formaldehyde, and SiO2-Np. The nano-RPF resins demonstrated high thermal stability at temperatures above 500°C. The adhesive performance of the nano-RPF resins was investigated under dry and wet conditions. The nano-RPF resins indicated better adhesive performance than unmodified RPF resin. The RPF resin could be improved by SiO2-Np. © 2021 Statny Drevarsky Vyskumny Ustav. All rights reserved.eninfo:eu-repo/semantics/openAccessAdhesive performancePhenol-formaldehydeSilica nanoparticlesThermal stabilityArticle10.37763/WR.1336-4561/66.1.1611692-s2.0-851031810741691Q216166