Tom, B.Kayabasi, E.2024-09-292024-09-2920212148-3736https://doi.org/10.31202/ecjse.909855https://search.trdizin.gov.tr/tr/yayin/detay/1130311https://hdl.handle.net/20.500.14619/9007In this study, a microchannel heat exchanger was proposed instead of a conventional air-cooled heat sink in order to obtain uniform surface temperature distribution. In addition, flow and heat transfer simulations were performed using Flo-EFD software. First, the temperature distribution of the air domain and microprocessor in the computer case was obtained. Afterward, the system with the proposed microchannel heat exchanger was subjected to the same processes, and the results were compared. As a result of the study, it was revealed that the microchannel heat exchanger reduced the processor temperature between 54-55 °C and 18-19 °C. It has also been observed that removing the heat sink allows the air drawn from the outside environment to circulate more efficiently around other heat-generating elements in the computer case. Hence, a more homogeneous and lower temperature distribution within the computer case was obtained. © 2021, TUBITAK. All rights reserved.eninfo:eu-repo/semantics/openAccessEthyleneHeat exchangerLiquid coolingMicrochannelMicroprocessorArticle10.31202/ecjse.9098552-s2.0-8512058178212533Q4124311303118