Meydaneri, FatmaSaatci, BuketOzdemir, Mehmet2024-09-292024-09-2920100378-38121879-0224https://doi.org/10.1016/j.fluid.2010.07.015https://hdl.handle.net/20.500.14619/4651The variations of thermal conductivities of solid phases versus temperature for pure Sn, pure Al and Sn-0.5 wt.% Al, Sn-2.2 wt.% Al, Sn-25 wt.% Al, Sn-50 wt.% Al, Sn-75 wt.% Al binary alloys were measured with a radial heat flow apparatus. From thermal conductivity variations versus temperature, the thermal conductivities of the solid phases at their melting temperature and temperature coefficients for same materials were also found to be 60.60 +/- 0.06. 208.80 +/- 0.22, 69.70 +/- 0.07, 80.30 +/- 0.08, 112.30 +/- 0.12, 142.00 +/- 0.15, 188.50 +/- 0.20 W/K m and 0.00098, 0.00062, 0.00127, 0.00114, 0.00112, 0.00150, 0.00116 K-1, respectively. The thermal conductivity ratios of liquid phase to solid phase for the pure Sn, pure Al and eutectic Sn-0.5 wt.% Al alloy at their melting temperature are found to be 1.11, 1.13, 1.06 with a Bridgman type directional solidification apparatus, respectively. Thus the thermal conductivities of liquid phases for pure Sn, pure Al and eutectic Sn-0.5 wt.% Al binary alloy at their melting temperature were evaluated to be 67.26, 235.94 and 73.88 W/K m, respectively by using the values of solid phase thermal conductivities and the thermal conductivity ratios of liquid phase to solid phase. (C) 2010 Elsevier B.V. All rights reserved.eninfo:eu-repo/semantics/closedAccessThermal conductivityRadial heat flowDirectional solidificationSn-Al alloyThermal coefficientArticle10.1016/j.fluid.2010.07.0152-s2.0-797515349531051Q297298WOS:000283023700013Q1