Tayyar, I.H.Colak, B.2024-09-292024-09-292017978-150906269-01559-9450https://doi.org/10.1109/PIERS.2017.8262309https://hdl.handle.net/20.500.14619/9295et al.; Institute of Electrical and Electronics Engineers (IEEE); St. Petersburg State University; The Swedish Institute; Tomsk Polytechnic University; University of Gavle2017 Progress In Electromagnetics Research Symposium - Spring, PIERS 2017 -- 22 May 2017 through 25 May 2017 -- St. Petersburg -- 134321In this work, the scattering of the TM waves by a homogeneously filled slit in a thick impedance screen (see Figure 1) has been analyzed through the Wiener-Hopf method. The contribution of our work lies in the boundary conditions imposed on the thick screen walls. It is supposed that the lateral walls of the slit and horizontal walls of the thick screen have different surface impedances. The results to be obtained by this work will enable us to carry out the effects of the multiple scattering processes arising between slit edges and the influence of the surface impedances and material filling of the thick slit on the scattering phenomenon. In order to validate the present Wiener-Hopf solution experimental verification of the filled slit in a thick impedance screen has been implemented in microwave frequencies with good agreements. © 2018 Electromagnetics Academy. All rights reserved.eninfo:eu-repo/semantics/closedAccessRadiationExperimental verificationHorizontal wallsMultiple scattering processScattering phenomenonSurface impedancesTM scatteringWiener-Hopf methodWiener-Hopf solutionCondensed matter physicsConference Object10.1109/PIERS.2017.82623092-s2.0-850449447223215N/A3209