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    Experimental determination of interfacial energy for solid Sn in the Sn-Ag alloy by using radial heat flow type solidification apparatus
    (Elsevier, 2011) Saatci, B.; Meydaneri, F.; Ozdermir, M.; Yilmaz, E.; Ulgen, A.
    The equilibrated grain boundary groove shapes for solid Sn in equilibrium with the (Sn-3.84 at.% Ag) eutectic liquid were observed from a quenched sample at the eutectic temperature for about 18 days with a radial heat flow apparatus. This is the first time that the equilibrated grain boundary groove shapes of solid Sn in equilibrium with the (Sn-3.84 at.% Ag) eutectic liquid have been observed using radial heat flow apparatus. From the observed grain boundary groove shapes, the Gibbs-Thomson coefficient, the solid-liquid interfacial energy and grain boundary energy for solid Sn in equilibrium with the (Sn-3.84 at% Ag) eutectic liquid were determined to be (8.54+/-0.42) x 10(-8)Km, (113.32+/-11.33) mJ/m(2) and (216.11+/-23.77) mJ/m(2), respectively. Published by Elsevier B.V.
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    Structural and transport properties of Sn-Mg alloys
    (Springer, 2013) Saatci, B.; Ari, M.; Gunduz, M.; Turktekin, S.; Meydaneri, F.; Durmus, S.; Ozdemir, M.
    In this work, the structural and transport properties of Mg-doped Sn-based alloys have been investigated. The temperature-dependent transport and structural properties of Sn-Mg alloys were investigated for five different samples (Pure Sn, Sn-1.0 wt% Mg, Sn-2.0 wt% Mg, Sn-6.0 wt% Mg and Pure Mg). Scanning electron microscopy (SEM), X-ray diffraction and energy dispersive X-ray analysis measurements were carried out in order to clarify the structural properties of the samples. It was found that the samples had tetragonal crystal symmetry, except for pure Mg which had hexagonal crystal symmetry. We also found that the cell parameters changed slightly with the addition of Mg element. The SEM micrographs of the samples showed that they had smooth surfaces with a clear grain boundary. The electrical and thermal conductivity of the samples were measured by four-point probe and the radial heat flow method, respectively. The electrical resistivity of the samples increased almost linearly with the increasing temperature. The thermal conductivity values ranged between 0.60 and 1.00 W/Km, while they decreased slightly with temperature and increased with Mg composition. The thermal conductivity values of the alloys were in between the values of pure Sn and Mg. The thermal conductivity results of the alloys were compared with other available results, and a good agreement was seen between the results. In addition, the temperature coefficients of electrical resistivity and thermal conductivity were determined; these were independent of the composition of the alloying elements.
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    STRUCTURAL, SURFACE AND TRANSPORT PROPERTIES OF Sn-Ag ALLOYS
    (World Scientific Publ Co Pte Ltd, 2017) Tezel, F. Meydaneri; Saatci, B.; Ari, M.; Acer, S. Durmus; Altuner, E.
    The structural, surface and transport properties of Sn-Ag alloys were investigated by X-ray diffraction (XRD), radial heat flow, energy-dispersive X-ray (EDX) analysis, scanning electron microscopy (SEM) and four-point probe techniques. We observed that the samples had tetragonal crystal symmetry except for the pure Ag sample which had cubic crystal symmetry, and with the addition of Ag the cell parameters increased slightly. Smooth surfaces with a clear grain boundary for the samples were shown on the SEM micrographs. The grain sizes of pure Ag, beta-Sn and the formed Ag3Sn intermetallic compound phase for Sn-x wt.% Ag [x=1.5, 3.5] binary alloys were determined to be 316nm, between 92 nm and 80 nm and between 36 nm and 34 nm, respectively. The values of electrical resistivity for pure Sn, pure Ag and Sn-x wt.% Ag [x=1.5, 3.5] were obtained to be 22.60x10(-8), 62.36x10(-8), 23.54x10(-8), 24.62x10(-8) Omega.m at the temperature range of 300-450K, respectively. Thermal conductivity values of pure Sn and Sn-x wt.% Ag [x=1.5, 3.5] binary alloys were found to be 60.60 +/- 3.75, 69.00 +/- 4.27 and 84.60 +/- 5.24 W/Km. These values slightly decreased with increasing temperature and increase with increasing of the Ag composition. Additionally, the temperature coefficients of thermal conductivity and electrical resistivity and the Lorenz numbers were calculated.
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    Thermal, electrical, microstructure and microhardness properties of the eutectic Sn-3.5wt.%Ag alloy
    (Redakcia Kovove Materialy, 2013) Meydaneri, F.; Saatci, B.; Ozdemir, M.
    The variation of thermal conductivity with temperature for Sn-3.5wt.%Ag eutectic alloy was measured with a radial heat flow apparatus. The thermal conductivity of the solid phase and temperature coefficient were also found to be 84.60 +/- 0.09 W K-1 m(-1) and 5.92 x 10(-4) K-1, respectively. The values of enthalpy of fusion (Delta H) and the specific heat (C-p) were also determined by differential scanning calorimeter (DSC) from heat flow curves during the transformation from eutectic solid to eutectic liquid. The variation of electrical conductivity with temperature for Sn-3.5wt.%Ag eutectic alloy was determined from the Wiedemann-Franz law by using the measured values of thermal conductivity. The microhardness of Sn-3.5wt.%Ag eutectic alloy was measured at approximately 5 different points with Vickers microhardness device. The microstructure of Sn-3.5wt.%Ag eutectic alloy was investigated by using scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis.