Effect of bismuth addition on the corrosion dynamics of sn–3ag–0.5cu solder alloy in hydrochloric acid solution
Küçük Resim Yok
Tarih
2021
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Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
This study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy in\r1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy\rdispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate\rthat the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a\rtrue passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive\rregion does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1\rwt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement\rof silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and\rstability of protective passive corrosion products.
Açıklama
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Kaynak
International Journal of Innovative Engineering Applications
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Cilt
5
Sayı
1
