Effect of melting temperature on wettability of sn-ag-cu alloys on cu substrate

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dc.contributor.authorErer, Ahmet Mustafa
dc.date.accessioned2024-09-29T16:33:31Z
dc.date.available2024-09-29T16:33:31Z
dc.date.issued2018
dc.departmentKarabük Üniversitesien_US
dc.description.abstractIn this study, effect of melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures (250, 280 and 310 ). The melting temperatures of alloys were examined by differential scanning calorimeter (DSC) that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90 at 310 on Cu substrate.en_US
dc.identifier.endpage589en_US
dc.identifier.issn1302-0900
dc.identifier.issue3en_US
dc.identifier.startpage587en_US
dc.identifier.trdizinid297131en_US
dc.identifier.urihttps://search.trdizin.gov.tr/tr/yayin/detay/297131
dc.identifier.urihttps://hdl.handle.net/20.500.14619/11942
dc.identifier.volume21en_US
dc.indekslendigikaynakTR-Dizinen_US
dc.institutionauthorErer, Ahmet Mustafa
dc.language.isoenen_US
dc.relation.ispartofPoliteknik Dergisien_US
dc.relation.publicationcategoryMakale - Ulusal Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.titleEffect of melting temperature on wettability of sn-ag-cu alloys on cu substrateen_US
dc.typeArticleen_US

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