Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate

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dc.authoridErer, Ahmet Mustafa/0000-0003-4358-4010
dc.contributor.authorErer, Ahmet Mustafa
dc.date.accessioned2024-09-29T16:06:51Z
dc.date.available2024-09-29T16:06:51Z
dc.date.issued2018
dc.departmentKarabük Üniversitesien_US
dc.description.abstractIn this study, effect of melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures (250, 280 and 310 degrees C). The melting temperatures of alloys were examined by differential scanning calorimeter (DSC) that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90 degrees at 310 degrees C on Cu substrate.en_US
dc.identifier.doi10.2339/politeknik.399077
dc.identifier.endpage589en_US
dc.identifier.issn1302-0900
dc.identifier.issn2147-9429
dc.identifier.issue3en_US
dc.identifier.startpage587en_US
dc.identifier.urihttps://doi.org/10.2339/politeknik.399077
dc.identifier.urihttps://hdl.handle.net/20.500.14619/7086
dc.identifier.volume21en_US
dc.identifier.wosWOS:000444156000010en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.language.isoenen_US
dc.publisherGazi Univen_US
dc.relation.ispartofJournal of Polytechnic-Politeknik Dergisien_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectContact angleen_US
dc.subjectmelting temperatureen_US
dc.subjectwettabilityen_US
dc.titleEffect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrateen_US
dc.typeArticleen_US

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