Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Pb-Free Solder Alloy

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dc.contributor.authorErer, A.M.
dc.contributor.authorUyanik, O.
dc.contributor.authorTüren, Y.
dc.date.accessioned2024-09-29T16:16:20Z
dc.date.available2024-09-29T16:16:20Z
dc.date.issued2019
dc.departmentKarabük Üniversitesien_US
dc.description.abstractThis study reports the investigation on indium addition into Sn–3Ag-0.5Cu (SAC305) ternary Pb-free solder alloy to evole its varied performances. The effects of indium addition on wettability of the solder alloy was studied. The experimental results exhibited that when the addition of indium was 1.0 wt.%, the change in melting temperature of Sn–2Ag-0.5Cu–1In (SAC-1In) solder was negligible, but the contact angles (?) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in Ar atmosphere. Inter-metallic phases, microstructures, and melting temperatures of alloy was characterized by X-ray diffraction (XRD), scanning electron microscope and energy dispersive X-ray spectroscopy (SEM + EDX), and differential scanning calorimeter (DSC), and effects of the amount of In on microstructure were investigated. The lowest ? was obtained as 35,55° at 310 °C. The formation of intermetallic compounds (IMC’s) between the Pb-free solder alloy and the Cu substrate was observed. As a result, the studies show that the wetting capability of Sn–2Ag-0.5Cu–1In quaternary solder alloy is better than Sn–3Ag-0.5Cu ternary alloy. © 2019, TUBITAK. All rights reserved.en_US
dc.description.sponsorshipTUBITAK 3001 Initiative Research and Development Project Support Programen_US
dc.identifier.doi10.31202/ecjse.441434
dc.identifier.endpage7en_US
dc.identifier.issn2148-3736
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-85150747310en_US
dc.identifier.scopusqualityQ4en_US
dc.identifier.startpage1en_US
dc.identifier.trdizinid386025en_US
dc.identifier.urihttps://doi.org/10.31202/ecjse.441434
dc.identifier.urihttps://search.trdizin.gov.tr/tr/yayin/detay/386025
dc.identifier.urihttps://hdl.handle.net/20.500.14619/9017
dc.identifier.volume6en_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakTR-Dizinen_US
dc.language.isoenen_US
dc.publisherTUBITAKen_US
dc.relation.ispartofEl-Cezeri Journal of Science and Engineeringen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectContact Angleen_US
dc.subjectPb-free Solder Alloysen_US
dc.subjectWettabilityen_US
dc.titleEffect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Pb-Free Solder Alloyen_US
dc.title.alternativeSn-2Ag-0,5Cu-1In Dörtlü Kurşunsuz Lehim Alaşımının Islatabilirliğine İndiyumun Etkisien_US
dc.typeArticleen_US

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