Experimental study of diffusion welding/bonding of titanium to copper

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dc.authoridkaya, yakup/0000-0002-9951-2844
dc.authoridKAHRAMAN, NIZAMETTIN/0000-0002-7152-3795
dc.contributor.authorAydin, Kemal
dc.contributor.authorKaya, Yakup
dc.contributor.authorKahraman, Nizamettin
dc.date.accessioned2024-09-29T15:57:53Z
dc.date.available2024-09-29T15:57:53Z
dc.date.issued2012
dc.departmentKarabük Üniversitesien_US
dc.description.abstractIn the present study, Ti-6Al-4V alloy was bonded to electrolytic copper at various temperatures of 875, 890 and 900 degrees C and times of 15, 30 and 60 min through diffusion bonding. 3 MPa uniaxial load was applied during the diffusion bonding. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analysed by means of optical microscopy, scanning electron microscopy and energy dispersive spectrometer. The bonding of Ti-6Al-4V to Cu was successfully achieved by diffusion bonding method. The maximum shear strength was found to be 2171 N for the specimen bonded at 890 degrees C for 60 min. The maximum hardness values were obtained from the area next to the interface in titanium side of the joint. The hardness values were found to decrease with increasing distance from the interface in titanium side while it remained constant in copper side. It was seen that the diffusion transition zone near the interface consists of various phases of beta Cu4Ti, Cu2Ti, Cu3Ti2, Cu4Ti3 and CuTi. (C) 2012 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.matdes.2012.01.026
dc.identifier.endpage368en_US
dc.identifier.issn0264-1275
dc.identifier.issn1873-4197
dc.identifier.scopus2-s2.0-84856562915en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage356en_US
dc.identifier.urihttps://doi.org/10.1016/j.matdes.2012.01.026
dc.identifier.urihttps://hdl.handle.net/20.500.14619/5069
dc.identifier.volume37en_US
dc.identifier.wosWOS:000301591700045en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier Sci Ltden_US
dc.relation.ispartofMaterials & Designen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectD. Diffusion bondingen_US
dc.subjectE. Mechanical propertiesen_US
dc.subjectG. Scanning electron microscopyen_US
dc.titleExperimental study of diffusion welding/bonding of titanium to copperen_US
dc.typeArticleen_US

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