Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite solder

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dc.authoridMohd Nazeri, Muhammad Firdaus/0000-0003-4923-0184
dc.contributor.authorAhmad, Ibrahym
dc.contributor.authorNazeri, Muhammad Firdaus Mohd
dc.contributor.authorSalleh, Nor Azmira
dc.contributor.authorKheawhom, Soorathep
dc.contributor.authorErer, Ahmet Mustafa
dc.contributor.authorKurt, Adem
dc.contributor.authorMohamad, Ahmad Azmin
dc.date.accessioned2024-09-29T15:55:03Z
dc.date.available2024-09-29T15:55:03Z
dc.date.issued2021
dc.departmentKarabük Üniversitesien_US
dc.description.abstractThe morphological changes of SAC305 solder alloy with the addition of 0.07 wt% graphene was investigated using selective electrochemical etching. To evaluate the effect of graphene inclusion, selective electrochemical removal of the beta-Sn phase from SAC305 and SAC305/0.07GNP was performed using a standard three-electrode cell approach at specific potentials determined by cyclic voltammetry. The phase, chemical structure and microstructural changes were observed. The texture and the phases of SAC305 solder paste were retained, while the microstructure of beta-Sn and Ag3Sn was refined owning to graphene addition. Sufficient removal of beta-Sn without affecting other phases was obtained by using etching potential below -350 mV. Due to Van der Waals force attraction, two types of agglomeration of graphene were observed from cross-sectional observation. Large agglomerations seen at the vicinity of solder/substrate interface were found to help in forming diffusion barrier. This contributes to the refinement of microstructure with the presence of graphene. Accurate observation regarding the shape and texture of the intermetallic compound (IMC) phases affected by the addition of graphene provided by selective electrochemical removal helps better insight into understanding the electrochemical dissolution mechanism of SAC alloys. (C) 2021 The Author(s). Published by Elsevier B.V. on behalf of King Saud University.en_US
dc.description.sponsorshipTin Industry (Research and Development) Board Research Grant 2021 [304.PBAHAN.6050479.L114]en_US
dc.description.sponsorshipThe authors appreciate the financial support provided by Tin Industry (Research and Development) Board Research Grant 2021 (304.PBAHAN.6050479.L114)en_US
dc.identifier.doi10.1016/j.arabjc.2021.103392
dc.identifier.issn1878-5352
dc.identifier.issn1878-5379
dc.identifier.issue10en_US
dc.identifier.scopus2-s2.0-85114053364en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.urihttps://doi.org/10.1016/j.arabjc.2021.103392
dc.identifier.urihttps://hdl.handle.net/20.500.14619/4424
dc.identifier.volume14en_US
dc.identifier.wosWOS:000705993200042en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.relation.ispartofArabian Journal of Chemistryen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectLead-free soldersen_US
dc.subjectSn-3.0Ag-0.5Cuen_US
dc.subjectSelective electrochemical etchingen_US
dc.subjectMicrostructureen_US
dc.subjectGrapheneen_US
dc.subjectComposite solderen_US
dc.titleSelective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite solderen_US
dc.typeArticleen_US

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