Performance and cooling efficiency of thermoelectric modules on server central processing unit and Northbridge

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dc.authoridDEMIREL, Huseyin/0000-0003-2983-1425
dc.contributor.authorTan, Serhat Orkun
dc.contributor.authorDemirel, Huseyin
dc.date.accessioned2024-09-29T15:55:14Z
dc.date.available2024-09-29T15:55:14Z
dc.date.issued2015
dc.departmentKarabük Üniversitesien_US
dc.description.abstractComputer systems are required to process data more rapidly than ever, due to recent software and internet technology developments. The server computers work continuously and provide services to many clients simultaneously, which results in greater heat production and high temperature that must be managed in order to avoid malfunction and failure of critical hardware. In this study, three cooling systems were used, comparatively to examine the temperature and performance of the CPU and motherboard. The temperature characteristics and performance of the CPU were tested with a heat sink, water cooling system, and thermoelectric cooler. According to the test results, the thermoelectric cooling system has better cooling performance than the other two systems under continuous operating conditions. Additionally, the performance rating of the CPU was the best with a thermoelectric cooler under varying workloads. (C) 2015 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.compeleceng.2015.07.012
dc.identifier.endpage55en_US
dc.identifier.issn0045-7906
dc.identifier.issn1879-0755
dc.identifier.scopus2-s2.0-84951942591en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage46en_US
dc.identifier.urihttps://doi.org/10.1016/j.compeleceng.2015.07.012
dc.identifier.urihttps://hdl.handle.net/20.500.14619/4514
dc.identifier.volume46en_US
dc.identifier.wosWOS:000367122800004en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherPergamon-Elsevier Science Ltden_US
dc.relation.ispartofComputers & Electrical Engineeringen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectThermoelectric moduleen_US
dc.subjectCPUen_US
dc.subjectCooling systemsen_US
dc.subjectServeren_US
dc.subjectNorthbridgeen_US
dc.titlePerformance and cooling efficiency of thermoelectric modules on server central processing unit and Northbridgeen_US
dc.typeArticleen_US

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