Optimization of adherend thickness and overlap length on failure load of bonded 3D printed PETG parts using response surface method
Küçük Resim Yok
Tarih
2024
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Emerald Group Publishing Ltd
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
PurposeAdhesive bonding is critical to the effectiveness and structural integrity of 3D printed components. The purpose of this study is to investigate the effect of joint configuration on failure loads to improve the design and performance of single lap joints (SLJs) in 3D printed parts.Design/methodology/approachIn this study, adherends were fabricated using material extrusion 3D printing technology with polyethylene terephthalate glycol (PETG). A toughened methacrylate adhesive was chosen to bond the SLJs after adherend printing. In this study, response surface methodology (RSM) was used to examine the effect of the independent variables of failure load, manufacturing time and mass on the dependent variable of joint configuration; adherend thickness (3.2, 4.0, 4.8, 5.6, 6.4, and 7.2 mm) and overlap lengths (12.7, 25.4, 38.1, and 50.8 mm) of 3D printed PETG SLJs.FindingsThe strength of the joints improved significantly with the increase in overlap length and adherend thickness, although the relationship was not linear. The maximum failure load occurred with a thickness of 7.2 mm and an overlap of 50.8 mm, whilst the minimum failure load was determined with a thickness of 3.2 mm and an overlap of 12.7 mm. The RSM findings show that the optimum failure load was achieved with an adherend thickness of 3.6 mm and an overlap length of 37.9 mm for SLJ.Originality/valueThis study provides insight into the optimum failure load for 3D printed SLJs, reducing SLJ production time and mass, producing lightweight structures due to the nature of 3D printing, and increasing the use of these parts in load-bearing applications.
Açıklama
Anahtar Kelimeler
Adhesion, Material extrusion, Response surface method, Joining, Failure load
Kaynak
Rapid Prototyping Journal
WoS Q Değeri
N/A
Scopus Q Değeri
Q1
Cilt
30
Sayı
8
