Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

Basit Öğe Kaydı
dc.authoridOGUZ, Serkan/0000-0001-6315-8970
dc.contributor.authorOguz, Serkan
dc.contributor.authorErer, Ahmet Mustafa
dc.date.accessioned2024-09-29T16:03:02Z
dc.date.available2024-09-29T16:03:02Z
dc.date.issued2023
dc.departmentKarabük Üniversitesien_US
dc.description.abstractIn this study, the wetting and microstructural properties of SACBi-xAl (x = 0.05, 0.1, 0.3, 0.5, and 0.6%) quinary lead-free solder alloys produced by adding various amounts of Al to the quaternary SAC-1Bi lead-free solder alloy (wt%) were investigated. The wetting and microstructural properties of Al-added quinary lead-free solder alloys on Cu substrate in an Ar gas atmosphere were investigated. It was reported that the best wetting angle (38.44 degrees for the 325 degrees C temperature value) and melting temperature (212.5 degrees C) belonged to the SACBi-0.1Al solder alloy. When the microstructural properties are examined, it is seen with the help of SEM images that the CuAl IMC phase, which is rich in Al, has replaced Cu6Sn5 and Ag3Sn IMCs.en_US
dc.description.sponsorshipKarabuk University Scientific Research Project (BAP); [KBUEBAP-21-KP-091]en_US
dc.description.sponsorshipThis work was supported by the Karabuk University Scientific Research Project (BAP). Within the scope of the Comprehensive Research Project, it was supported with the project number 'KBUEBAP-21-KP-091'.en_US
dc.identifier.doi10.1088/1402-4896/acfb44
dc.identifier.issn0031-8949
dc.identifier.issn1402-4896
dc.identifier.issue11en_US
dc.identifier.scopus2-s2.0-85182029759en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.urihttps://doi.org/10.1088/1402-4896/acfb44
dc.identifier.urihttps://hdl.handle.net/20.500.14619/5861
dc.identifier.volume98en_US
dc.identifier.wosWOS:001081812300001en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherIop Publishing Ltden_US
dc.relation.ispartofPhysica Scriptaen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectAl-added lead-free solder alloyen_US
dc.subjectwetting angleen_US
dc.subjectSACBi-Alen_US
dc.subjectsessile dropen_US
dc.titleEffect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systemsen_US
dc.typeArticleen_US

Dosyalar

Koleksiyon

WoS İndeksli Yayınlar Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu