Influence of Indium Addition on Wetting Characteristics of Sn-3Ag-0.5Cu Solder Alloy on Cu Substrate

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dc.contributor.authorErer, Ahmet Mustafa
dc.contributor.authorUyanik, Okan
dc.contributor.authorTuren, Yunus
dc.date.accessioned2024-09-29T16:01:10Z
dc.date.available2024-09-29T16:01:10Z
dc.date.issued2018
dc.departmentKarabük Üniversitesien_US
dc.description34th International Physics Congress (IPS) of the Turkish-Physical-Society (TPS) -- SEP 05-09, 2018 -- Konacik, TURKEYen_US
dc.description.abstractThis work investigates the effect of Indium (In) addition, 0.5 wt.% In, on the wettability of the Sn-3Ag-0.5Cu (SAC305) ternary pb-free solder alloy. Adding In to SAC305 decreased the contact angles (.) of the Sn-2.5Ag-0.5Cu-0.5In quaternary pb-free solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 degrees C) on Cu substrate in Ar atmosphere. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The results indicated that when the addition of In was 0.5 wt.%, the change in melting temperature of Sn-2.5Ag-0.5Cu-0.5In solder was negligible, but the contact angles (.) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures. The lowest. was obtained as 45.22 degrees for Sn-2.5Ag-0.5Cu0.5In alloy at 310 degrees C. The formation of intermetallic compounds (IMC) between the Pb-free solder alloys and the Cu substrate was observed. Thus, If the amounts of indium and silver are optimized, the Sn-2Ag-0.5Cu-0.5In quaternary solder alloy may be a suitable potential candidate to replace conventional Sn-3.0Ag-0.5Cu solder to provide economic gain in solder alloy production.en_US
dc.description.sponsorshipTurkish Phys Socen_US
dc.description.sponsorshipTUBITAK 3001 Initiative Research and Development Project Support Program [117M083]en_US
dc.description.sponsorshipThis study is supported by the project number 117M083 by TUBITAK 3001 Initiative Research and Development Project Support Program.en_US
dc.identifier.doi10.1063/1.5078878
dc.identifier.isbn978-0-7354-1768-7
dc.identifier.issn0094-243X
dc.identifier.scopus2-s2.0-85057205959en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.urihttps://doi.org/10.1063/1.5078878
dc.identifier.urihttps://hdl.handle.net/20.500.14619/5569
dc.identifier.volume2042en_US
dc.identifier.wosWOS:000468358900006en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherAmer Inst Physicsen_US
dc.relation.ispartofTurkish Physical Society 34th International Physics Congress (Tps34)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.titleInfluence of Indium Addition on Wetting Characteristics of Sn-3Ag-0.5Cu Solder Alloy on Cu Substrateen_US
dc.typeConference Objecten_US

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