Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys
Küçük Resim Yok
Tarih
2020
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Sciendo
Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
This study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.
Açıklama
Anahtar Kelimeler
Sn-Zn lead-free alloys, investment casting, mechanical properties
Kaynak
Materials Science-Poland
WoS Q Değeri
Q4
Scopus Q Değeri
N/A
Cilt
38
Sayı
1