A new approach for measuring the wetting angles of lead-free solder alloys from digital images

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dc.contributor.authorSehirli, Eftal
dc.contributor.authorErer, Ahmet Mustafa
dc.contributor.authorTuran, Muhammed Kamil
dc.date.accessioned2024-09-29T15:57:36Z
dc.date.available2024-09-29T15:57:36Z
dc.date.issued2022
dc.departmentKarabük Üniversitesien_US
dc.description.abstractThis study aims to detect quaternary lead-free solder alloys and measure their dynamic wetting angles with a new approach. The detection of the prepared alloy drop and measurement of its wetting angle are automatically performed by the developed application. A video obtained after experimental studies is filtered over its frames and enhanced a better form in the preprocessing stage. The peak of the half alloy drop is detected by obtaining lane histogram and its global minimum point is found in the segmentation stage. Left and right corner points in contact with the ground are detected by tracking pixel intensity values with the help of the global minimum point. The median point for both left half alloy drop and right half alloy drop is calculated. Thus, circles passing through three points for the left half and right half of the alloy drop are obtained to measure theta(left), theta(right) and theta(mean) wetting angles. In the postprocessing stage, these angles are measured at 0th, 5th, 10th, 15th, 30th, 60th, 90th, 120th, 150th, and 300th seconds after the alloy drop contacted the ground. Besides, measurement of these wetting angles is performed at each second. The obtained results showed that the graph of theta(mean) versus time is an exponential decay graph. This result proves that the alloy drop spreads over the ground as time passes and the value of theta(mean) decreases and is consistent with the observation made during the experiment. (c) 2022 Karabuk University. Publishing services by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).en_US
dc.identifier.doi10.1016/j.jestch.2022.101279
dc.identifier.issn2215-0986
dc.identifier.scopus2-s2.0-85142830923en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.urihttps://doi.org/10.1016/j.jestch.2022.101279
dc.identifier.urihttps://hdl.handle.net/20.500.14619/4913
dc.identifier.volume36en_US
dc.identifier.wosWOS:001163933900001en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier - Division Reed Elsevier India Pvt Ltden_US
dc.relation.ispartofEngineering Science and Technology-An International Journal-Jestechen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectAlloy drop detectionen_US
dc.subjectContact angle measurementen_US
dc.subjectImage processingen_US
dc.subjectSignal processingen_US
dc.titleA new approach for measuring the wetting angles of lead-free solder alloys from digital imagesen_US
dc.typeArticleen_US

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