Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution

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dc.authoridObaid, Dr. Masoud Giyathaddin/0000-0002-6875-2108
dc.authoridErer, Ahmet Mustafa/0000-0003-4358-4010
dc.contributor.authorObaid, Masoud Giyathaddin
dc.contributor.authorErer, Ahmet Mustafa
dc.date.accessioned2024-09-29T15:57:57Z
dc.date.available2024-09-29T15:57:57Z
dc.date.issued2024
dc.departmentKarabük Üniversitesien_US
dc.description.abstractThis study examines how adding aluminum to the SAC205-1In-xAl solder alloys in a 1 M hydrochloride acid HCl solution affects their corrosion behavior. HCL acid has a faster corrosion rate than other electrolytes because it contains chlorine (Cl- ) and hydrogen (H+) ions. In contrast to other electrolytes like salt and alkaline solutions, which only have one type of ion species for causing corrosion, The characteristics of the produced solder alloy samples were investigated using SEM and EDX tests. Corrosion potentials were shown by polarization investigations, adding 0.3, 0.5, 0.7, 0.8, and 0.9 wt% Al to the SAC205-1In solder alloy. Based on polarization analyses, the produced solder alloys exhibit slightly different corrosion potentials when Al is added in comparison to the corrosion potentials of SAC305 and SAC205-1In. Corrosion rates exhibit a pattern whereby adding 0.8 wt% Al reduces the corrosion rate. However, as less aluminum is replaced with tin, the corrosion rate slightly increases. SAC205-1In's corrosion rates were enhanced by the addition of Al.en_US
dc.description.sponsorshipKarabuk University Scientific Research Project (BAP) [KBUEBAP-21-KP-091]en_US
dc.description.sponsorshipThis work was supported by the Karabuk University Scientific Research Project (BAP) . Within the scope of the Comprehensive Research Project, it was supported with the project number 'KBUEBAP-21-KP-091'.en_US
dc.identifier.doi10.1016/j.microrel.2023.115307
dc.identifier.issn0026-2714
dc.identifier.issn1872-941X
dc.identifier.scopus2-s2.0-85180373281en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.urihttps://doi.org/10.1016/j.microrel.2023.115307
dc.identifier.urihttps://hdl.handle.net/20.500.14619/5116
dc.identifier.volume152en_US
dc.identifier.wosWOS:001141985600001en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherPergamon-Elsevier Science Ltden_US
dc.relation.ispartofMicroelectronics Reliabilityen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectMicrostructureen_US
dc.subjectCorrosion rateen_US
dc.subjectSACen_US
dc.subjectHClen_US
dc.subjectPotentiodynamic polarizationen_US
dc.subjectIntermetallic compoundsen_US
dc.titleAluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solutionen_US
dc.typeArticleen_US

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