Design and simulation of a microchannel heat exchanger for cooling a micro processor using ethylene
Küçük Resim Yok
Tarih
2021
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
TUBITAK
Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
In this study, a microchannel heat exchanger was proposed instead of a conventional air-cooled heat sink in order to obtain uniform surface temperature distribution. In addition, flow and heat transfer simulations were performed using Flo-EFD software. First, the temperature distribution of the air domain and microprocessor in the computer case was obtained. Afterward, the system with the proposed microchannel heat exchanger was subjected to the same processes, and the results were compared. As a result of the study, it was revealed that the microchannel heat exchanger reduced the processor temperature between 54-55 °C and 18-19 °C. It has also been observed that removing the heat sink allows the air drawn from the outside environment to circulate more efficiently around other heat-generating elements in the computer case. Hence, a more homogeneous and lower temperature distribution within the computer case was obtained. © 2021, TUBITAK. All rights reserved.
Açıklama
Anahtar Kelimeler
Ethylene, Heat exchanger, Liquid cooling, Microchannel, Microprocessor
Kaynak
El-Cezeri Journal of Science and Engineering
WoS Q Değeri
Scopus Q Değeri
Q4
Cilt
8
Sayı
3
