Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

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dc.authoridErer, Ahmet Mustafa/0000-0003-4358-4010
dc.contributor.authorErer, Ahmet Mustafa
dc.contributor.authorOguz, Serkan
dc.date.accessioned2024-09-29T16:03:26Z
dc.date.available2024-09-29T16:03:26Z
dc.date.issued2020
dc.departmentKarabük Üniversitesien_US
dc.description.abstractPurpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310 degrees C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (theta) was obtained as 35,34 degrees for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 degrees C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.en_US
dc.description.sponsorshipTUBITAK 3001 Initiative Research and Development Project Support Program [117M083]en_US
dc.description.sponsorshipThis study is supported by the project number 117M083 by TUBITAK 3001 Initiative Research and Development Project Support Program.en_US
dc.identifier.doi10.1108/SSMT-08-2018-0028
dc.identifier.endpage23en_US
dc.identifier.issn0954-0911
dc.identifier.issn1758-6836
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-85073957712en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.startpage19en_US
dc.identifier.urihttps://doi.org/10.1108/SSMT-08-2018-0028
dc.identifier.urihttps://hdl.handle.net/20.500.14619/6086
dc.identifier.volume32en_US
dc.identifier.wosWOS:000507117100003en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherEmerald Group Publishing Ltden_US
dc.relation.ispartofSoldering & Surface Mount Technologyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectContact angleen_US
dc.subjectWettabilityen_US
dc.subjectIMC'sen_US
dc.subjectPb-free solder alloyen_US
dc.titleWetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systemsen_US
dc.typeArticleen_US

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