The effect of input parameters on material removal rate of CK45 DIN 17200 by electric discharge machining

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dc.contributor.authorHasan, S.H.
dc.contributor.authorÇolak, B.
dc.contributor.authorAghdeab, S.H.
dc.date.accessioned2024-09-29T16:21:04Z
dc.date.available2024-09-29T16:21:04Z
dc.date.issued2024
dc.departmentKarabük Üniversitesien_US
dc.descriptionUniversity of Technologyen_US
dc.description3rd International Conference on Electromechanical Engineering and its Applications, ICEMEA 2022 -- 19 July 2022 through 20 July 2022 -- Baghdad -- 200213en_US
dc.description.abstractThe purpose of this research is to investigate the influence of input parameters (current, pulse on, pulse off) on materials eviction rate (MRR) when cutting CK45 DIN 17500 as a workpiece, and the material of the electrode is copper (pure). The input parameters for the practical side were current in values (10, 30, and 50 A) and pulse on-time values (50, 100, and 200?s). The studies were created with a full factorial design, and the results showed that the MRR increases as the current and a timely rise in pulse rate. The anticipated outcomes are extremely close to the obtained outcomes. Electrical discharge machining phrases: EDM, materials eviction rate, MRR, current, factorial analysis. © 2024 Author(s).en_US
dc.identifier.doi10.1063/5.0205869
dc.identifier.issn0094-243X
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-85196502044en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.urihttps://doi.org/10.1063/5.0205869
dc.identifier.urihttps://hdl.handle.net/20.500.14619/9520
dc.identifier.volume3002en_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherAmerican Institute of Physicsen_US
dc.relation.ispartofAIP Conference Proceedingsen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.titleThe effect of input parameters on material removal rate of CK45 DIN 17200 by electric discharge machiningen_US
dc.typeConference Objecten_US

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