Futuristic methods of electronics cooling
Küçük Resim Yok
Tarih
2023
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Elsevier
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Power density for high-performance chips has recently increased due to advancements in semiconductors, other mini- and micro-scale electronic technologies, and continued miniaturization. Heat is generated when the current passes over a resistance, and internal losses are unavoidable. Electronic devices produce heat this way while working. This heat needs to be taken from electronic devices due to its effect on their performance. The fault ratio on electronic devices increases exponentially as the temperature increases. That is how high operation temperature occurs from heat production on electronic devices that are not controlled and designed to cause safety and performance decreases. This reality is to make it necessary for heat transfer, namely, developing cooling systems and new investigations, and to increase the importance of thermal control on the operation and design parameters of electronic devices day by day. In this chapter electronic device cooling methods are classified as advanced cooling technologies (active and passive cooling methods) with the goal of guiding future research while representing current application areas. © 2023 Elsevier Inc. All rights reserved.
Açıklama
Anahtar Kelimeler
Cooling, Electronic, Heat pipe, PCM, Thermal control, Thermoelectric cooling
Kaynak
Handbook of Thermal Management Systems: E-Mobility and Other Energy Applications
WoS Q Değeri
Scopus Q Değeri
N/A
