Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate

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dc.authoridErer, Ahmet Mustafa/0000-0003-4358-4010
dc.contributor.authorErer, Ahmet Mustafa
dc.contributor.authorOguz, Serkan
dc.contributor.authorTuren, Yunus
dc.date.accessioned2024-09-29T15:57:33Z
dc.date.available2024-09-29T15:57:33Z
dc.date.issued2018
dc.departmentKarabük Üniversitesien_US
dc.description.abstractThis work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag-0.5Cu (SAC305) ternary Pb-free solder alloy. Adding Bi to SAC305 decreased the contact angles (theta) of the Sn-2.0Ag-0.5Cu-1.0Bi (SAC-1Bi) quaternary Pb-free solder alloy, which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 degrees C) on Cu substrate in argon (Ar) atmosphere. Microstructures, inter-metallic phases and melting temperatures were analyzed by optical microscope, scanning electron microscopy, X-ray diffraction, and differential scanning calorimetry, and effects of the amount of Bi on microstructure were investigated. The experimental results exhibited that when the addition of Bi was 1 wt%, changing in melting temperature of SAC-1Bi solder was insignificant, but the wetting angles (h) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures. The lowest h was obtained as 35.6 degrees for SAC-1Bi alloy at 310 degrees C. (C) 2018 Karabuk University. Publishing services by Elsevier B.V.en_US
dc.description.sponsorshipScientific and Technological Research Council of Turkey (TUBITAK) [117M083]en_US
dc.description.sponsorshipThis study, the Scientific and Technological Research Council of Turkey (TUBITAK) was supported by. Within the scope of TUBITAK 3001 Start-up Research and Development Projects Support Program, this study were supported with project number 117M083.en_US
dc.identifier.doi10.1016/j.jestch.2018.10.002
dc.identifier.endpage1163en_US
dc.identifier.issn2215-0986
dc.identifier.issue6en_US
dc.identifier.scopus2-s2.0-85054450106en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage1159en_US
dc.identifier.urihttps://doi.org/10.1016/j.jestch.2018.10.002
dc.identifier.urihttps://hdl.handle.net/20.500.14619/4883
dc.identifier.volume21en_US
dc.identifier.wosWOS:000449023100006en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier - Division Reed Elsevier India Pvt Ltden_US
dc.relation.ispartofEngineering Science and Technology-An International Journal-Jestechen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectWettabilityen_US
dc.subjectContact angleen_US
dc.subjectPb-free solder alloyen_US
dc.titleInfluence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrateen_US
dc.typeArticleen_US

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