Bond Strength/Disbonding Behavior and Dimensional Stability of Wood Materials with Different Adhesives

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dc.contributor.authorKurt, Seref
dc.contributor.authorUysal, Burhanettin
dc.date.accessioned2024-09-29T15:50:38Z
dc.date.available2024-09-29T15:50:38Z
dc.date.issued2010
dc.departmentKarabük Üniversitesien_US
dc.description.abstractIn this study, we aimed to describe the effects of adhesives [poly(vinyl acetate) (PVAc), Desmodur vinyl trie ketonol acetate, and urea formaldehyde (UF)] on wooden materials (Scotch pine and oriental beech) cut tangentially and radially impregnated with Protim Solignum, chromate copper arsenate (CCA), and Celcure AC 500 and exposed to humidity and water and heat-resistance, heating, and cooling tests. For the adhesives, the highest swelling (4.3%) was obtained for oriental beech bonded with UF and cut radially, and the lowest swelling (1%) was obtained for Scotch pine bonded with PVAc and cut radially. For the control samples, the humidity-resistance, water-resistance, heat-resistance, and heating and cooling tests decreased the bonding strength. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 115:438-450, 2010en_US
dc.identifier.doi10.1002/app.31038
dc.identifier.endpage450en_US
dc.identifier.issn0021-8995
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-73949095429en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.startpage438en_US
dc.identifier.urihttps://doi.org/10.1002/app.31038
dc.identifier.urihttps://hdl.handle.net/20.500.14619/3636
dc.identifier.volume115en_US
dc.identifier.wosWOS:000271671500054en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherJohn Wiley & Sons Incen_US
dc.relation.ispartofJournal of Applied Polymer Scienceen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectadhesionen_US
dc.subjectadhesivesen_US
dc.subjectcompositesen_US
dc.subjectdegradationen_US
dc.titleBond Strength/Disbonding Behavior and Dimensional Stability of Wood Materials with Different Adhesivesen_US
dc.typeArticleen_US

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