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Öğe Aluminum addition to Sn-3Ag-0.5Cu-1In-xAl alloy effect on corrosion kinetics in HCl acid solution(Pergamon-Elsevier Science Ltd, 2024) Obaid, Masoud Giyathaddin; Erer, Ahmet MustafaThis study examines how adding aluminum to the SAC205-1In-xAl solder alloys in a 1 M hydrochloride acid HCl solution affects their corrosion behavior. HCL acid has a faster corrosion rate than other electrolytes because it contains chlorine (Cl- ) and hydrogen (H+) ions. In contrast to other electrolytes like salt and alkaline solutions, which only have one type of ion species for causing corrosion, The characteristics of the produced solder alloy samples were investigated using SEM and EDX tests. Corrosion potentials were shown by polarization investigations, adding 0.3, 0.5, 0.7, 0.8, and 0.9 wt% Al to the SAC205-1In solder alloy. Based on polarization analyses, the produced solder alloys exhibit slightly different corrosion potentials when Al is added in comparison to the corrosion potentials of SAC305 and SAC205-1In. Corrosion rates exhibit a pattern whereby adding 0.8 wt% Al reduces the corrosion rate. However, as less aluminum is replaced with tin, the corrosion rate slightly increases. SAC205-1In's corrosion rates were enhanced by the addition of Al.Öğe Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems(Iop Publishing Ltd, 2023) Oguz, Serkan; Erer, Ahmet MustafaIn this study, the wetting and microstructural properties of SACBi-xAl (x = 0.05, 0.1, 0.3, 0.5, and 0.6%) quinary lead-free solder alloys produced by adding various amounts of Al to the quaternary SAC-1Bi lead-free solder alloy (wt%) were investigated. The wetting and microstructural properties of Al-added quinary lead-free solder alloys on Cu substrate in an Ar gas atmosphere were investigated. It was reported that the best wetting angle (38.44 degrees for the 325 degrees C temperature value) and melting temperature (212.5 degrees C) belonged to the SACBi-0.1Al solder alloy. When the microstructural properties are examined, it is seen with the help of SEM images that the CuAl IMC phase, which is rich in Al, has replaced Cu6Sn5 and Ag3Sn IMCs.Öğe Effect of bismuth addition on the corrosion dynamics of sn–3ag–0.5cu solder alloy in hydrochloric acid solution(2021) Erer, Ahmet MustafaThis study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy in\r1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy\rdispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate\rthat the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a\rtrue passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive\rregion does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1\rwt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement\rof silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and\rstability of protective passive corrosion products.Öğe Effect of Bismuth on Wettability of Sn-2.5Ag-0.5Cu-0 Bi Quaternary Solder Alloy on Cu Substrate(Amer Inst Physics, 2018) Erer, Ahmet Mustafa; Oguz, SerkanThis study reports the investigation on Bismuth (Bi) addition into Su-3.0Ag-0.5Cu (SAC305) ternary lead-free solder to improves its various performances. The effects of Bi addition on the wettability of the solder alloy was studied. The results showed that when the addition of Bi was 0.5 wt.%, the change in the inciting temperature of Sn-2.5Ag-0.5Cu0.5Bi (SAC-0.5Bi) solder was negligible, but the contact angles (0) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 C) on Cu substrate in Ar atmosphere. Mierostnictures, inter -metallic phases, and melting temperatures of alloys were characterized by optic microscope and SEM and EDX, XRD, and DSC, and effects of the amount of Bi on microstructure were investigated. The lowest 0 was obtained as 39.22 for the SAC-0.5Bi alloy at 310 C. As a result, the studies show that the wetting capability of SAC-0.5Bi quaternary alloy is better than SAC305 ternary alloy.Öğe Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate(Gazi Univ, 2018) Erer, Ahmet MustafaIn this study, effect of melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures (250, 280 and 310 degrees C). The melting temperatures of alloys were examined by differential scanning calorimeter (DSC) that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90 degrees at 310 degrees C on Cu substrate.Öğe Effect of melting temperature on wettability of sn-ag-cu alloys on cu substrate(2018) Erer, Ahmet MustafaIn this study, effect of melting temperatures of Sn-3Ag (SAC300), Sn-3Ag-0.5Cu (SAC305) and Sn-0.3Ag-0.7Cu (SAC0307) ternary Pb-free solder alloys on wettability were investigated. The sessile drop technique was used in order to evaluate the contact angles of Pb-free solder alloys on Cu substrate at predetermined temperatures (250, 280 and 310 ). The melting temperatures of alloys were examined by differential scanning calorimeter (DSC) that SAC305 Pb-free alloy has lower than those of SAC300 and SAC0307 alloys. The best wettability was found for SAC305 and this was followed by SAC300 and SAC0307. The lowest value of contact angle for SAC305 was 41.90 at 310 on Cu substrate.Öğe Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder(Elsevier Sci Ltd, 2019) Nasir, Siti Shareeda Mohd; Yahaya, Muhamad Zamri; Erer, Ahmet Mustafa; Illes, Balks; Mohamad, Ahmad AzminThe improvement in the hardness of Sn-3.0Ag-0.5Cu solder alloy reinforced with 1.0 wt % TiO2 nanoparticles was evaluated by nanoindentation. A specific indentation array was performed on four different horizontal cross sections of the composite solder with different heights and diameters, in order to verify the mixing homogeneity of TiO2 nanoparticles within the Sn-3.0Ag-0.5Cu solder paste during the ball milling process. The phase analysis indicated successful blending of the Sn-3.0Ag-0.5Cu with the TiO2 nanoparticles. According the scanning electron microscopy micrographs, presence of the TiO2 nanoparticles reduced the size of the Cu6Sn5 and Ag3Sn intermetallic compound phases. Incorporation of the 1.0 wt % TiO2 nanoparticles improved the hardness values up to 26.2% than that of pure SAC305. The hardness values increased gradually from the top cross sections towards adjacent to the solder/substrate interface. The mechanism of the hardness improvement attained by the TiO2 nanoparticles addition were also investigated on the horizontal cross sections of the samples.Öğe Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate(Elsevier - Division Reed Elsevier India Pvt Ltd, 2018) Erer, Ahmet Mustafa; Oguz, Serkan; Turen, YunusThis work investigates the effect of bismuth (Bi) addition, 1 wt% Bi, on wettability of the Sn-3.0Ag-0.5Cu (SAC305) ternary Pb-free solder alloy. Adding Bi to SAC305 decreased the contact angles (theta) of the Sn-2.0Ag-0.5Cu-1.0Bi (SAC-1Bi) quaternary Pb-free solder alloy, which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 degrees C) on Cu substrate in argon (Ar) atmosphere. Microstructures, inter-metallic phases and melting temperatures were analyzed by optical microscope, scanning electron microscopy, X-ray diffraction, and differential scanning calorimetry, and effects of the amount of Bi on microstructure were investigated. The experimental results exhibited that when the addition of Bi was 1 wt%, changing in melting temperature of SAC-1Bi solder was insignificant, but the wetting angles (h) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures. The lowest h was obtained as 35.6 degrees for SAC-1Bi alloy at 310 degrees C. (C) 2018 Karabuk University. Publishing services by Elsevier B.V.Öğe Influence of Indium Addition on Wetting Characteristics of Sn-3Ag-0.5Cu Solder Alloy on Cu Substrate(Amer Inst Physics, 2018) Erer, Ahmet Mustafa; Uyanik, Okan; Turen, YunusThis work investigates the effect of Indium (In) addition, 0.5 wt.% In, on the wettability of the Sn-3Ag-0.5Cu (SAC305) ternary pb-free solder alloy. Adding In to SAC305 decreased the contact angles (.) of the Sn-2.5Ag-0.5Cu-0.5In quaternary pb-free solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 degrees C) on Cu substrate in Ar atmosphere. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The results indicated that when the addition of In was 0.5 wt.%, the change in melting temperature of Sn-2.5Ag-0.5Cu-0.5In solder was negligible, but the contact angles (.) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures. The lowest. was obtained as 45.22 degrees for Sn-2.5Ag-0.5Cu0.5In alloy at 310 degrees C. The formation of intermetallic compounds (IMC) between the Pb-free solder alloys and the Cu substrate was observed. Thus, If the amounts of indium and silver are optimized, the Sn-2Ag-0.5Cu-0.5In quaternary solder alloy may be a suitable potential candidate to replace conventional Sn-3.0Ag-0.5Cu solder to provide economic gain in solder alloy production.Öğe The Investigation of the Effect of Cu Addition on the Nb-V Microalloyed Steel Produced by Powder Metallurgy(Int Inst Science Sintering (I I S S), 2022) Erden, Mehmet Akif; Erer, Ahmet Mustafa; Odabasi, Cagri; Gunduz, SuleymanIn this work, the effect of Cu content on the microstructures, mechanical properties and electrical conductivity of Nb-V added microalloyed powder metallurgy (PM) steels were investigated. Microalloyed steel samples were pressed at 750 MPa and sintered at 1400 degrees C in argon atmosphere for 1 h. The grain size and phase distribution of the microalloy steels were determined by optical microscope. The precipitates and fracture surface of samples were analyzed with the help of SEM and EDS analyses. Tensile test, hardness test and electrical conductivity measurement were carried out for the Nb-V added microalloyed steel with different Cu content. Results indicated that 10 wt.% Cu added PM microalloyed steel showed the highest values in yield strength (YS) and ultimate tensile strength (UTS). However, when the amount of Cu content increased from 10 to 15 wt.%, YS and UTS decreased. Elongation also tends to decrease with increasing Cu content. Although the electrical conductivity in general increased with the addition of Cu, a decrease in some conductivity was observed in the addition of 15 wt.% Cu.Öğe A new approach for measuring the wetting angles of lead-free solder alloys from digital images(Elsevier - Division Reed Elsevier India Pvt Ltd, 2022) Sehirli, Eftal; Erer, Ahmet Mustafa; Turan, Muhammed KamilThis study aims to detect quaternary lead-free solder alloys and measure their dynamic wetting angles with a new approach. The detection of the prepared alloy drop and measurement of its wetting angle are automatically performed by the developed application. A video obtained after experimental studies is filtered over its frames and enhanced a better form in the preprocessing stage. The peak of the half alloy drop is detected by obtaining lane histogram and its global minimum point is found in the segmentation stage. Left and right corner points in contact with the ground are detected by tracking pixel intensity values with the help of the global minimum point. The median point for both left half alloy drop and right half alloy drop is calculated. Thus, circles passing through three points for the left half and right half of the alloy drop are obtained to measure theta(left), theta(right) and theta(mean) wetting angles. In the postprocessing stage, these angles are measured at 0th, 5th, 10th, 15th, 30th, 60th, 90th, 120th, 150th, and 300th seconds after the alloy drop contacted the ground. Besides, measurement of these wetting angles is performed at each second. The obtained results showed that the graph of theta(mean) versus time is an exponential decay graph. This result proves that the alloy drop spreads over the ground as time passes and the value of theta(mean) decreases and is consistent with the observation made during the experiment. (c) 2022 Karabuk University. Publishing services by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).Öğe Numerical computation of wetting angles of Sn-(3-x)Ag-0.5Cu-x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate(World Scientific Publ Co Pte Ltd, 2020) Erer, Ahmet Mustafa; Okten Turaci, MukaddesThis paper was aimed to study of the wetting angle (circle minus) of Sn-Ag-Cu, Sn-(3-x)Ag-0.5Cu-(x)Bi and Sn-(3-x)Ag-0.5Cu-(x)In (x = 0:5, 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310 degrees C) on Cu substrate in Ar atmosphere. The new Sn-(3-x)Ag0.5Cu-xBi and Sn-(3-x)Ag-0.5Cu-(x) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn3wt.%Ag-0.5wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn-2.5wt.%Ag-0.5wt. %Cu-0.5wt.%Bi (SAC-0.5Bi), Sn-2wt.%Ag-0.5wt.%Cu-1wt.%Bi(SAC-1Bi), Sn-1wt.% Ag-0.5 wt.%Cu-2 wt.%Bi(SAC-2Bi), Sn-2.5 wt.%Ag-0.5 wt.%Cu-0.5 wt.%In (SAC-0.5In), Sn-2 wt.%Ag-0.5 wt.%Cu-1 wt.%In (SAC-1In) and Sn-1 wt.%Ag-0.5 wt%.Cu-2 wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the circle minus up to 1 wt.% above which the-value was increased and it is appeared that a correlation among the circle minus, alloys compositions and the test temperatures exists which recommended an empirical model to estimate the circle minus at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the-understandably well with the present work.Öğe Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite solder(Elsevier, 2021) Ahmad, Ibrahym; Nazeri, Muhammad Firdaus Mohd; Salleh, Nor Azmira; Kheawhom, Soorathep; Erer, Ahmet Mustafa; Kurt, Adem; Mohamad, Ahmad AzminThe morphological changes of SAC305 solder alloy with the addition of 0.07 wt% graphene was investigated using selective electrochemical etching. To evaluate the effect of graphene inclusion, selective electrochemical removal of the beta-Sn phase from SAC305 and SAC305/0.07GNP was performed using a standard three-electrode cell approach at specific potentials determined by cyclic voltammetry. The phase, chemical structure and microstructural changes were observed. The texture and the phases of SAC305 solder paste were retained, while the microstructure of beta-Sn and Ag3Sn was refined owning to graphene addition. Sufficient removal of beta-Sn without affecting other phases was obtained by using etching potential below -350 mV. Due to Van der Waals force attraction, two types of agglomeration of graphene were observed from cross-sectional observation. Large agglomerations seen at the vicinity of solder/substrate interface were found to help in forming diffusion barrier. This contributes to the refinement of microstructure with the presence of graphene. Accurate observation regarding the shape and texture of the intermetallic compound (IMC) phases affected by the addition of graphene provided by selective electrochemical removal helps better insight into understanding the electrochemical dissolution mechanism of SAC alloys. (C) 2021 The Author(s). Published by Elsevier B.V. on behalf of King Saud University.Öğe Sn-(3-x)ag-0,5cu-x(in,bi) dörtlü kurşunsuz lehim alaşımlarının islatma özelliklerinin cu altlık üzerinde incelenmesi(2019) Erer, Ahmet Mustafa; Türen, YunusBu projede, Ag elementinin yüksek maliyetli olmasından dolayı, hem Ag oranından azaltarak maliyeti düsürmeyi hem de Sn-Ag-Cu (SAC) üçlü ötektik kursunsuz lehim alasımına In ve Bi ilave ederek ıslatma degerlerini, geleneksel Sn-Pb ikili ötektik kursunlu lehim alasımlarının verilerine yakın hale getirmeye çalısılacaktır. Bu çalısma düsük maliyet, yüksek verim ve güvenilirlik unsurları dikkate alınarak yapılacaktır. Günümüzde Pb içeren lehim kullanımı çevre ve insan saglıgına zararlı olması nedeniyle sakıncalıdır ve kursun içerikli lehim kullanımı EU RoHS ve WEEE yönergeleri ile kısıtlanmıstır. Bu sebeplerden dolayı son yıllarda çevre ve insan saglıgına duyarlı kursunsuz lehim alasımları gelistirilmeye çalısılmaktadır. Sn-Ag, Sn-Cu ve Sn-Ag-Cu tabanlı kursunsuz lehim alasımlarıSn-Pb kursunlu lehim alasımlarına alternatif olarak gösterilmektedir. Kursun içerikli lehimlere alternative olan bu alasımlar içerisinde Sn-Ag-Cu (SAC) tabanlı kursunsuz lehim alasımları yüksek mekanik özellikler ve lehimleme kabiliyetine sahip olmalarından dolayı oldukça iyi bilinmektedir. Yüksek oranda Ag içeren geleneksel SAC kursunsuz lehim alasımlarının maliyetinin fazla olması nedeniyle kullanımları sınırlıdır. Son on yıl içinde Sn- 3Ag-0.5Cu (SAC305) kursunsuz lehimi elektronik endüstrisi için çok önemli bir materyal olmustur. SAC üçlü kursunsuz lehim alasımında Ag miktarının azalması, alasımın sıvılasma ve katılasma sıcaklıgı arasındaki farkı artırır. Ag metal oranının azalması hem maliyeti azaltır hem de lehimin güvenilirligini artırır. Bu nedenle düsük oranda Ag içeren SAC lehim alasımları tercih edilmektedir. Literatürde özellikle SAC lehim alasımlarına düsük ergime noktasına sahip Bi ve In elementleri eklenerek kursunsuz lehim alasımının ıslatma özellikleri incelenmistir. Ayrıca, lehim alasımının erime sıcaklıgını düsürmek için kullanılacak alasım elementi RoHS standartlarına uyumlu olmak zorundadır. El-Daly ve arkadaslarının yaptıkları çalısmalarda,SAC kursunsuz lehimlerine Bi ilavesi edilmesi ile diferansiyel tarama kalorimetresi (DSC) sonuçlarına göre asırı soguma, ötektik sıcaklıgı, katılasma ve sıvılasma sıcaklıgı oranının önemli ölçüde azaldıgını belirtmislerdir. SAC tabanlı lehimlere Bi ilave edilmesi ile ıslatma davranısı gelistirilmistir. Deneysel veriler SAC alasımına Bi ilavesinin lehimin yüzey gerilimini azalttıgını göstermektedir. SAC305 üçlü kursunsuz lehim alasımlarına Bi ilave edilmesi ile IMC katmanının yayılma hızının geciktirildigi ve lehimin güç düzeyinin gelistirildigi görülmüstür. Lehim/Cu ara yüzündeki intermetalik bilesiklerin (IMC) kalınlıgı yaslanma sıcaklıgı ile artar. Sn-3Ag-0.5Cu-xBi kursunsuz lehim alasımları IMC parçacıklarının farklı türleri lehim matrisinde olusur. Lehimin yayılması Bi ilavesi ile düsmüstür. SAC305 üçlü kursunsuz lehim alasımına %4 kadar Bi eklenmesi ile Sn- 3Ag-0.5Cu-xBi lehim alasımının yayılma direnci gelistirilmistir. Lehim alasımlarında yüksek maliyetten dolayı Ag metal oranının ıslatma özelliklerini etkilemeyecek sekilde mümkün olan en az seviyede tutulması önem arz etmektedir. Özellikle ıslatma özelliklerinin gelistirilmesi için dördüncü bir alasım elementi seçimi ve ilavesi arastırma konusunun temelini olusturmaktadır. Daha önce doktora tez çalısması kapsamında yapılan deneylerde kullanılan deney seti eksiklikleri giderilerek gelistirilecektir. Projedeki deneysel çalısmalar bu set vasıtasıyla gerçeklestirilecektir. Bu proje kapsamında, Hem Ag miktarını azaltarak maliyetin düsürülmesi, hem de Sn-3Ag-0.5Cu (SAC305) üçlü kursunsuz lehim alasımına belirlenen oranlarda (%0,5; %1 ve %2) In ve Bi ilave edilerek üretilen Sn-(3- x)Ag-0.5Cu-x(In,Bi) dörtlü kursunsuz lehim alasımlarının Cu altlık üzerindeki ıslatma özelliklerinin gelistirilmesi amaçlanmaktadırÖğe Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems(Emerald Group Publishing Ltd, 2020) Erer, Ahmet Mustafa; Oguz, SerkanPurpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310 degrees C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (theta) was obtained as 35,34 degrees for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 degrees C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.
