Effect of Bismuth on Wettability of Sn-2.5Ag-0.5Cu-0 Bi Quaternary Solder Alloy on Cu Substrate
Küçük Resim Yok
Tarih
2018
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Amer Inst Physics
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
This study reports the investigation on Bismuth (Bi) addition into Su-3.0Ag-0.5Cu (SAC305) ternary lead-free solder to improves its various performances. The effects of Bi addition on the wettability of the solder alloy was studied. The results showed that when the addition of Bi was 0.5 wt.%, the change in the inciting temperature of Sn-2.5Ag-0.5Cu0.5Bi (SAC-0.5Bi) solder was negligible, but the contact angles (0) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 C) on Cu substrate in Ar atmosphere. Mierostnictures, inter -metallic phases, and melting temperatures of alloys were characterized by optic microscope and SEM and EDX, XRD, and DSC, and effects of the amount of Bi on microstructure were investigated. The lowest 0 was obtained as 39.22 for the SAC-0.5Bi alloy at 310 C. As a result, the studies show that the wetting capability of SAC-0.5Bi quaternary alloy is better than SAC305 ternary alloy.
Açıklama
34th International Physics Congress (IPS) of the Turkish-Physical-Society (TPS) -- SEP 05-09, 2018 -- Konacik, TURKEY
Anahtar Kelimeler
Lead-Free Solders, Sn-Ag, Mechanical-Properties, Thermal-Property, Indium Addition, Microstructure, Strength, Solidification, Evolution, Creep
Kaynak
Turkish Physical Society 34th International Physics Congress (Tps34)
WoS Q Değeri
N/A
Scopus Q Değeri
N/A
Cilt
2042
