Effect of Bismuth on Wettability of Sn-2.5Ag-0.5Cu-0 Bi Quaternary Solder Alloy on Cu Substrate

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dc.contributor.authorErer, Ahmet Mustafa
dc.contributor.authorOguz, Serkan
dc.date.accessioned2024-09-29T16:01:10Z
dc.date.available2024-09-29T16:01:10Z
dc.date.issued2018
dc.departmentKarabük Üniversitesien_US
dc.description34th International Physics Congress (IPS) of the Turkish-Physical-Society (TPS) -- SEP 05-09, 2018 -- Konacik, TURKEYen_US
dc.description.abstractThis study reports the investigation on Bismuth (Bi) addition into Su-3.0Ag-0.5Cu (SAC305) ternary lead-free solder to improves its various performances. The effects of Bi addition on the wettability of the solder alloy was studied. The results showed that when the addition of Bi was 0.5 wt.%, the change in the inciting temperature of Sn-2.5Ag-0.5Cu0.5Bi (SAC-0.5Bi) solder was negligible, but the contact angles (0) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 C) on Cu substrate in Ar atmosphere. Mierostnictures, inter -metallic phases, and melting temperatures of alloys were characterized by optic microscope and SEM and EDX, XRD, and DSC, and effects of the amount of Bi on microstructure were investigated. The lowest 0 was obtained as 39.22 for the SAC-0.5Bi alloy at 310 C. As a result, the studies show that the wetting capability of SAC-0.5Bi quaternary alloy is better than SAC305 ternary alloy.en_US
dc.description.sponsorshipTurkish Phys Socen_US
dc.description.sponsorshipTUBITAK 3001 project [117M083]en_US
dc.description.sponsorshipThis work was supported by TUBITAK 3001 project with number of 117M083.en_US
dc.identifier.doi10.1063/1.5078880
dc.identifier.isbn978-0-7354-1768-7
dc.identifier.issn0094-243X
dc.identifier.scopus2-s2.0-85057155575en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.urihttps://doi.org/10.1063/1.5078880
dc.identifier.urihttps://hdl.handle.net/20.500.14619/5570
dc.identifier.volume2042en_US
dc.identifier.wosWOS:000468358900008en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherAmer Inst Physicsen_US
dc.relation.ispartofTurkish Physical Society 34th International Physics Congress (Tps34)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectLead-Free Soldersen_US
dc.subjectSn-Agen_US
dc.subjectMechanical-Propertiesen_US
dc.subjectThermal-Propertyen_US
dc.subjectIndium Additionen_US
dc.subjectMicrostructureen_US
dc.subjectStrengthen_US
dc.subjectSolidificationen_US
dc.subjectEvolutionen_US
dc.subjectCreepen_US
dc.titleEffect of Bismuth on Wettability of Sn-2.5Ag-0.5Cu-0 Bi Quaternary Solder Alloy on Cu Substrateen_US
dc.typeConference Objecten_US

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