Recent advances in adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines: A critical review
Küçük Resim Yok
Tarih
2019
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
wiley
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Adhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints. © 2019 Scrivener Publishing LLC.
Açıklama
Anahtar Kelimeler
Analytical and numerical studies, Bi-adhesive, Modulus-graded adhesive
Kaynak
Progress in Adhesion and Adhesives
WoS Q Değeri
Scopus Q Değeri
N/A
