Recent advances in adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines: A critical review

Küçük Resim Yok

Tarih

2019

Dergi Başlığı

Dergi ISSN

Cilt Başlığı

Yayıncı

wiley

Erişim Hakkı

info:eu-repo/semantics/closedAccess

Özet

Adhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints. © 2019 Scrivener Publishing LLC.

Açıklama

Anahtar Kelimeler

Analytical and numerical studies, Bi-adhesive, Modulus-graded adhesive

Kaynak

Progress in Adhesion and Adhesives

WoS Q Değeri

Scopus Q Değeri

N/A

Cilt

Sayı

Künye