Recent advances in adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines: A critical review

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dc.contributor.authorÖz, Ö.
dc.contributor.authorÖzer, H.
dc.date.accessioned2024-09-29T16:21:21Z
dc.date.available2024-09-29T16:21:21Z
dc.date.issued2019
dc.departmentKarabük Üniversitesien_US
dc.description.abstractAdhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints. © 2019 Scrivener Publishing LLC.en_US
dc.identifier.doi10.1002/9781119625322.ch3
dc.identifier.endpage97en_US
dc.identifier.isbn978-111962532-2
dc.identifier.isbn978-111962525-4
dc.identifier.scopus2-s2.0-85102161265en_US
dc.identifier.scopusqualityN/Aen_US
dc.identifier.startpage77en_US
dc.identifier.urihttps://doi.org/10.1002/9781119625322.ch3
dc.identifier.urihttps://hdl.handle.net/20.500.14619/9692
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherwileyen_US
dc.relation.ispartofProgress in Adhesion and Adhesivesen_US
dc.relation.publicationcategoryKitap Bölümü - Uluslararasıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectAnalytical and numerical studiesen_US
dc.subjectBi-adhesiveen_US
dc.subjectModulus-graded adhesiveen_US
dc.titleRecent advances in adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines: A critical reviewen_US
dc.typeBook Parten_US

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