Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review
Küçük Resim Yok
Tarih
2018
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Scrivener Publishing Llc
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Adhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints.
Açıklama
Anahtar Kelimeler
Bi-adhesive, modulus-graded adhesive, analytical and numerical studies
Kaynak
Reviews of Adhesion and Adhesives
WoS Q Değeri
N/A
Scopus Q Değeri
Q3
Cilt
6
Sayı
1
