Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review

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dc.contributor.authorOz, Ozkan
dc.contributor.authorOzer, Halil
dc.date.accessioned2024-09-29T16:10:02Z
dc.date.available2024-09-29T16:10:02Z
dc.date.issued2018
dc.departmentKarabük Üniversitesien_US
dc.description.abstractAdhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints.en_US
dc.identifier.doi10.7569/RAA.2018.097302
dc.identifier.endpage103en_US
dc.identifier.issn2168-0965
dc.identifier.issn2168-0973
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-85051123350en_US
dc.identifier.scopusqualityQ3en_US
dc.identifier.startpage82en_US
dc.identifier.urihttps://doi.org/10.7569/RAA.2018.097302
dc.identifier.urihttps://hdl.handle.net/20.500.14619/7918
dc.identifier.volume6en_US
dc.identifier.wosWOS:000437129800003en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherScrivener Publishing Llcen_US
dc.relation.ispartofReviews of Adhesion and Adhesivesen_US
dc.relation.publicationcategoryDiğeren_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectBi-adhesiveen_US
dc.subjectmodulus-graded adhesiveen_US
dc.subjectanalytical and numerical studiesen_US
dc.titleRecent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Reviewen_US
dc.typeReviewen_US

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