Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate
Küçük Resim Yok
Tarih
2011
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Cambridge Univ Press
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The contact angle (Theta) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 degrees C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Theta up to 3.5 wt.% above which the Theta value was increased. Increasing alloy temperature also decreased the Theta proportionally. Experimental results revealed that a correlation between the Theta, alloy composition and the alloy temperature exists which yielded an empirical model to predict the Theta at a given Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Theta reasonably well with the present work and the other published works.
Açıklama
Anahtar Kelimeler
Surface-Tension, Wetting Behavior, Wettability, Rough
Kaynak
European Physical Journal-Applied Physics
WoS Q Değeri
Q3
Scopus Q Değeri
Q3
Cilt
54
Sayı
1
