Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

Basit Öğe Kaydı
dc.authoridCandan, Ercan/0000-0002-0610-5044
dc.authoridErer, Ahmet Mustafa/0000-0003-4358-4010
dc.contributor.authorErer, A. M.
dc.contributor.authorCandan, E.
dc.contributor.authorGuven, M. H.
dc.contributor.authorTuren, Y.
dc.date.accessioned2024-09-29T16:01:08Z
dc.date.available2024-09-29T16:01:08Z
dc.date.issued2011
dc.departmentKarabük Üniversitesien_US
dc.description.abstractThe contact angle (Theta) of molten Sn and Sn-Ag alloys (0.5, 1.5, 3.5, 6 wt.% Ag) on Cu substrates have been studied by using sessile drop method at various temperatures (230, 250, 275 and 300 degrees C). Experimental results showed that additions of Ag to Sn resulted in a continuous decrease in the Theta up to 3.5 wt.% above which the Theta value was increased. Increasing alloy temperature also decreased the Theta proportionally. Experimental results revealed that a correlation between the Theta, alloy composition and the alloy temperature exists which yielded an empirical model to predict the Theta at a given Ag content and temperature for a given Sn-Ag alloy. The empirical model predicts the Theta reasonably well with the present work and the other published works.en_US
dc.identifier.doi10.1051/epjap/2011100487
dc.identifier.issn1286-0042
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-79959656561en_US
dc.identifier.scopusqualityQ3en_US
dc.identifier.urihttps://doi.org/10.1051/epjap/2011100487
dc.identifier.urihttps://hdl.handle.net/20.500.14619/5525
dc.identifier.volume54en_US
dc.identifier.wosWOS:000289624000016en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherCambridge Univ Pressen_US
dc.relation.ispartofEuropean Physical Journal-Applied Physicsen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectSurface-Tensionen_US
dc.subjectWetting Behavioren_US
dc.subjectWettabilityen_US
dc.subjectRoughen_US
dc.titleMeasurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrateen_US
dc.typeArticleen_US

Dosyalar

Koleksiyon

WoS İndeksli Yayınlar Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu